CVE Vulnerability

CVE-2019-14037

Close and bind operations done on a socket can lead to a Use-After-Free condition. in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in APQ8009, APQ8053, APQ8096AU, APQ8098, MDM9206, MDM9207C, MDM9607, MDM9640, MDM9650, MSM8905, MSM8909W, MSM8996, MSM8996AU, QCN7605, QCN7606, QCS605, SC8180X, SDA660, SDA845, SDM439, SDM630, SDM636, SDM660, SDM670, SDM710, SDM845, SDX20, SDX24, SDX55, SM8150, SXR1130

4.6 /10

CVSS v2.0 :

V3 Legend

Vector :

Exploitability : 3.9 / Impact : 6.4

Attack Vector

Attack Complexity

Privileges Required

User Interaction

Confidentiality Impact PARTIAL

Integrity Impact PARTIAL

Availability Impact PARTIAL

Scope

7.8 /10

CVSS v3.0 : HIGH

V3 Legend

Vector :

Exploitability : 1.8 / Impact : 5.9

Attack Vector LOCAL

Attack Complexity LOW

Privileges Required LOW

User Interaction NONE

Confidentiality Impact HIGH

Integrity Impact HIGH

Availability Impact HIGH

Scope UNCHANGED

References
Link Resource
https://www.qualcomm.com/company/product-security/bulletins/july-2020-bulletin Broken Link
https://www.qualcomm.com/company/product-security/bulletins/july-2020-security-bulletin Patch Vendor Advisory
Configurations

Configuration 1
Information

Published : 2020-07-30 12:15

Updated : 2020-07-31 01:55

NVD link : CVE-2019-14037

Mitre link : CVE-2019-14037

Products Affected

Qualcomm

Sxr1130

Sxr1130 Firmware

CWE
CWE-416