CVE Vulnerability

CVE-2018-11277

In Snapdragon (Automobile, Mobile, Wear) in version MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SDA660, the com.qualcomm.embms is a vendor package deployed in the system image which has an inadequate permission level and allows any application installed from Play Store to request this permission at install-time. The system application interfaces with the Radio Interface Layer leading to potential access control issue.

4.6 /10

CVSS v2.0 :

V3 Legend

Vector :

Exploitability : 3.9 / Impact : 6.4

Attack Vector

Attack Complexity

Privileges Required

User Interaction

Confidentiality Impact PARTIAL

Integrity Impact PARTIAL

Availability Impact PARTIAL

Scope

7.8 /10

CVSS v3.0 : HIGH

V3 Legend

Vector :

Exploitability : 1.8 / Impact : 5.9

Attack Vector LOCAL

Attack Complexity LOW

Privileges Required LOW

User Interaction NONE

Confidentiality Impact HIGH

Integrity Impact HIGH

Availability Impact HIGH

Scope UNCHANGED

References
Link Resource
https://www.qualcomm.com/company/product-security/bulletins Vendor Advisory
Configurations

Configuration 1
Information

Published : 2018-09-20 01:29

Updated : 2019-10-03 12:03

NVD link : CVE-2018-11277

Mitre link : CVE-2018-11277

Products Affected

Qualcomm

Sd616 Firmware

CWE
CWE-732