CVE Vulnerability

CVE-2020-11239

Use after free issue when importing a DMA buffer by using the CPU address of the buffer due to attachment is not cleaned up properly in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables

7.2 /10

CVSS v2.0 :

V3 Legend

Vector :

Exploitability : 3.9 / Impact : 10

Attack Vector

Attack Complexity

Privileges Required

User Interaction

Confidentiality Impact COMPLETE

Integrity Impact COMPLETE

Availability Impact COMPLETE

Scope

7.8 /10

CVSS v3.0 : HIGH

V3 Legend

Vector :

Exploitability : 1.8 / Impact : 5.9

Attack Vector LOCAL

Attack Complexity LOW

Privileges Required LOW

User Interaction NONE

Confidentiality Impact HIGH

Integrity Impact HIGH

Availability Impact HIGH

Scope UNCHANGED

References
Link Resource
https://www.qualcomm.com/company/product-security/bulletins/january-2021-bulletin Patch Vendor Advisory
Configurations

Configuration 1
Information

Published : 2021-06-09 05:15

Updated : 2021-06-15 07:41

NVD link : CVE-2020-11239

Mitre link : CVE-2020-11239

Products Affected

Ar8151 Firmware

Qualcomm

CWE
CWE-416