CVE’s

A component of the Huawei smartphone has a Double Free vulnerability. Local attackers may exploit this vulnerability to cause Root Elevation of Privileges.

A component of the Huawei smartphone has a External Control of System or Configuration Setting vulnerability. Local attackers may exploit this vulnerability to cause Kernel Code Execution.

There is an Information Disclosure Vulnerability in Huawei Smartphone.Successful exploitation of this vulnerability may lead to authentication bypass.

There is an out-of-bounds read vulnerability in eCNS280_TD V100R005C10 and eSE620X vESS V100R001C10SPC200, V100R001C20SPC200, V200R001C00SPC300. The vulnerability is due to a message-handling function that contains an out-of-bounds read vulnerability. An attacker can exploit this vulnerability by sending a specific message to the target device, which could cause a Denial of Service (DoS).

Huawei LTE USB Dongle products have an improper permission assignment vulnerability. An attacker can locally access and log in to a PC to induce a user to install a specially crafted application. After successfully exploiting this vulnerability, the attacker can perform unauthenticated operations. Affected product versions include:E3372 E3372h-153TCPU-V200R002B333D01SP00C00.

There is an Input Verification Vulnerability in Huawei Smartphone.Successful exploitation of this vulnerability may cause an infinite loop in DoS.

There is a Cleartext Transmission of Sensitive Information Vulnerability in Huawei Smartphone. Successful exploitation of this vulnerability may affect service confidentiality and availability.

Vulnerability in the Oracle MES for Process Manufacturing product of Oracle E-Business Suite (component: Process Operations). The supported version that is affected is 12.1.3. Easily exploitable vulnerability allows low privileged attacker with network access via HTTP to compromise Oracle MES for Process Manufacturing. Successful attacks of this vulnerability can result in unauthorized creation, deletion or modification access to critical data or all Oracle MES for Process Manufacturing accessible data as well as unauthorized access to critical data or complete access to all Oracle MES for Process Manufacturing accessible data. CVSS 3.1 Base Score 8.1 (Confidentiality and Integrity impacts). CVSS Vector: (CVSS:3.1/AV:N/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:N).

There is an Integer Underflow (Wrap or Wraparound) Vulnerability in Huawei Smartphone.Successful exploitation of this vulnerability may cause DoS of Samgr.

There is a race condition vulnerability in eCNS280_TD V100R005C00 and V100R005C10. There is a timing window exists in which the database can be operated by another thread that is operating concurrently. Successful exploit may cause the affected device abnormal.